Semiconductor devices. Micro-electromechanical devices-Wafer to wafer bonding strength measurement for MEMS
半导体器件 微机电设备

2013-01-31

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
半导体器件 - 微机电器件 - 第9部分:晶圆晶片接合强度测量

2011-07-13

Semiconductor devices. Micro-electromechanical devices-Test methods for MEMS piezoresistive pressure-sensitive device on wafer
半导体器件 微机电设备

2019-04-16

BS EN 62047-9. Semiconductor devices. Micro-electromechanical devices. Part 9. Wafer to wafer bonding strength measurement for MEMS
英国标准EN 62047-9 半导体器件 微型机电设备 第九部分 MEMS晶片间键合强度的测量

2007-12-05

Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer
半导体器件微机电器件第34部分:硅片上MEMS压阻压敏器件的试验方法

2019-04-05

Semiconductor devices. Micro-electromechanical devices-Test methods for determining residual stresses of MEMS films. Wafer curvature and cantilever beam deflection methods
半导体器件 微机电设备

2015-07-31

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
半导体器件 - 微机电器件 - 第16部分:确定MEMS膜残余应力的测试方法 - 晶片曲率和悬臂梁偏转方法

2015-03-05

Semiconductor devices - Part 5-18: Optoelectronic devices - Light emitting diodes - Test method of the macro photoluminescence for epitaxial wafers of micro light emitting diodes
半导体器件 第5-18部分:光电器件 发光二极管 微型发光二极管外延片宏观光致发光的试验方法

2026-06-11