IEC 60749的本部分建立了在可靠性测试之前确定非密封表面安装装置（SMD）预处理的标准程序。 该测试方法定义了代表典型工业多焊料回流操作的非密封固态SMD的预处理流程。 在提交给特定的内部可靠性测试（鉴定和/或可靠性监测）之前，这些SMD要经过本文件中描述的适当预处理顺序，以评估长期可靠性（受焊接应力影响）。购买本文件时可获得的所有当前修订均包含在购买本文件中。

This part of IEC 60749 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress).All current amendments available at time of purchase are included with the purchase of this document.