IEC 60749-30:2020 RLV包含官方IEC国际标准及其红线版本。Redline版本不是官方文档，它只有英文版本，为您提供了一种快速简单的方法来比较IEC官方标准与其以前版本之间的所有变化。 IEC 60749-30:2020建立了用于确定可靠性测试前非密封表面贴装器件(SMD)预处理的标准程序。 该测试方法定义了非密封固态SMD的预处理流程，代表了典型的工业多重焊料回流操作。 在提交特定的内部可靠性测试（鉴定和/或可靠性监测）之前，这些SMD经过本文件中描述的适当预处理序列，以评估长期可靠性（受焊接应力影响）。与上一版相比，此版本包括以下重大技术变更: -加入新订的第3条； -焊料回流时6.7的膨胀； -列入解释性说明和澄清。

IEC 60749-30:2020 RLV contains both the official IEC International Standard and its Redline version. The Redline version is not an official document, it is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.
The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation.
These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition:
- inclusion of new Clause 3;
- expansion of 6.7 on solder reflow;
- inclusion of explanatory notes and clarifications.