现行

IEC 62047-20-2014

Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
半导体器件微机电器件第20部分:陀螺仪

2014-06-26

现行

IEC 62047-22-2014

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
半导体器件微机电器件第22部分:柔性衬底上导电薄膜的机电拉伸试验方法

2014-06-19

现行

IEC 62047-19-2013

Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
半导体器件 - 微机电器件 - 第19部分:电子罗盘

2013-07-17

现行

IEC 62047-1-2016

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
半导体器件 - 微机电器件 - 第1部分:术语和定义

2016-01-06

现行

GB/T 42709.19-2023

半导体器件 微电子机械器件 第19部分：电子罗盘
Semiconductor devices—Micro-electromechanical devices—Part 19: Electronic compasses

2023-08-06

现行

IEC 62047-53-2025

Semiconductor devices - Micro-electromechanical devices - Part 53: MEMS electrothermal transfer device
半导体器件微机电器件第53部分:MEMS电热传递器件

2025-10-02

现行

IEC 62047-40-2021

Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold
半导体器件.微机电器件.第40部分:微机电惯性冲击开关阈值的试验方法

2021-09-03

现行

IEC 62047-42-2022

Semiconductor devices - Micro-electromechanical devices - Part 42: Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever
半导体器件.微机电器件.第42部分:压电MEMS悬臂梁的机电转换特性的测量方法

2022-09-16

现行

IEC 62047-35-2019

Semiconductor devices – Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices
半导体器件.微机电装置.第35部分:挠性机电装置弯曲变形电特性的试验方法

2019-11-22

现行

IEC 62047-50-2025

Semiconductor devices - Micro-electromechanical devices - Part 50: MEMS capacitive microphones
半导体器件微机电器件第50部分:MEMS电容传声器

2025-04-29

现行

IEC 62047-5-2011

Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
半导体器件 - 微机电器件 - 第5部分:RF MEMS开关

2011-07-13

现行

IEC 62047-4-2026

Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
半导体器件 - 微机电器件第4部分:Mems的通用规范

2026-01-07

现行

IEC 62047-4-2026 RLV

Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
半导体器件 - 微机电器件第4部分:Mems的通用规范

2026-01-07

现行

GB/T 42709.5-2023

半导体器件 微电子机械器件 第5部分：射频MEMS开关
Semiconductor devices—Micro-electromechanical devices—Part 5: RF MEMS switches

2023-05-23

现行

BS IEC 62047-30-2017

Semiconductor devices. Micro-electromechanical devices-Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
半导体器件 微机电设备

2017-10-09

现行

IEC 62047-33-2019

Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device
半导体器件微机电器件第33部分:MEMS压阻压敏器件

2019-04-05

现行

IEC 62047-10-2011

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
半导体器件 - 微机电器件 - 第10部分:MEMS材料的微柱压缩测试

2011-07-26

现行

IEC 62047-30-2017

Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
半导体器件 - 微机电器件 - 第30部分:MEMS压电薄膜机电转换特性的测量方法

2017-09-15

现行

IEC 62047-43-2024

Semiconductor devices - Micro-electromechanical devices - Part 43: Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
半导体器件.微机电器件.第43部分:柔性微机电器件循环弯曲变形后电气特性的试验方法

2024-03-19

现行

IEC 62047-41-2021

Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators
半导体器件.微机电器件.第41部分:RF MEMS环行器和隔离器

2021-06-15